23 results
6-K
EX-99.4
IMOS
Chipmos Technologies Inc
29 Apr 24
Current report (foreign)
6:10am
& small foot print requirements are driving the packaging technology development with the rising of emerging applications such as AI and 5G … 100um development;
(2)New structure of 2P2M Cu Pillar process;
(3)High-density (>4000 Chs) multilayer COF bonding packaging technology services;
(4
SD
IMOS
Chipmos Technologies Inc
18 May 23
Conflict minerals disclosure
6:11am
certifies that all products and packaging supplied by the conflict minerals supplier do not contain conflict minerals that are originated from the DRC
6-K
EX-99.4
IMOS
Chipmos Technologies Inc
28 Apr 23
Current report (foreign)
6:10am
financial structure.
Technological Developments
Single integrated device and the thinning & small foot print requirements are driving the packaging … technologies development results in 2022:
(1)Wafer level packaging: pure copper RDL for 2P2M RDL structure of complex circuit.
(2)Fine pitch 45um
SD
rwo4ngm0gebuq1o
19 May 22
Conflict minerals disclosure
6:11am
6-K
EX-99.4
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25 Apr 22
Current report (foreign)
6:11am
SD
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20 May 21
Conflict minerals disclosure
6:10am
6-K
EX-99.4
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29 Apr 21
Current report (foreign)
4:36pm
SD
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22 May 20
Conflict minerals disclosure
6:10am
6-K
EX-99.4
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8 May 20
Current report (foreign)
6:10am
SD
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28 May 19
Conflict minerals disclosure
6:07am
6-K
EX-99.5
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10 May 19
Current report (foreign)
6:11am
SD
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24 May 18
Conflict minerals disclosure
6:30am
6-K
EX-99.4
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23 May 18
2018 Annual Shareholders’ Meeting of
6:11am